English: Aproximative dimensions and structure of a power semiconductor die. This is a 3-terminal device, with two terminals on the top (the emitter and base for a BJT, the gate and emitter for an IGBT, the source and gate for a power MOSFET). The remaining terminal (respectively collector, collector and drain) is on the back.
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Cyril BUTTAY Aproximative dimensions and structure of a power semiconductor die. This is a 3-terminal device, with two terminals on the top (the emitter and base for a BJT, the gate and emitter for an IGBT, the source and gate for a power MOSFET). The re