File:System in package.png
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Summary
| Description |
English: A system-in-package (SiP) multi-chip module, which contains a CPU, DRAM and flash memory, all mounted on the same substrate. |
| Date | |
| Source | Own work |
| Author | Verdel |
Licensing
I, the copyright holder of this work, hereby publish it under the following license:
This file is licensed under the Creative Commons Attribution-Share Alike 4.0 International license.
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 12:39, 17 December 2020 | | 700 × 700 (111 KB) | Verdel | Uploaded own work with UploadWizard |
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