Talk:Reflow soldering

This article is within the scope of WikiProject Technology, a collaborative effort to improve the coverage of technology on Wikipedia. If you would like to participate, please visit the project page, where you can join the discussion and see a list of open tasks.TechnologyWikipedia:WikiProject TechnologyTemplate:WikiProject TechnologyTechnology articles

Metalworking C‑class Low‑importance

	This article is within the scope of WikiProject Metalworking, a collaborative effort to improve the coverage of Metalworking on Wikipedia. If you would like to participate, please visit the project page, where you can join the discussion and see a list of open tasks.MetalworkingWikipedia:WikiProject MetalworkingTemplate:WikiProject MetalworkingMetalworking articles
C	This article has been given a rating which conflicts with the project-independent quality rating in the banner shell. Please resolve this conflict if possible.
Low	This article has been rated as Low-importance on the project's importance scale.

Untitled

How to adjust the reflow profile to prevent Lead free process 0402(inch) component tombstone?

What are the advantage and Disadvantage of 5 Zone Reflow and 10 zone Reflow —Preceding unsigned comment added by 123.238.142.239 (talk) 05:18, 10 May 2010 (UTC)[reply]

Tombstoning could happen also with perfectly adjusted profiles. Tombstoning is normally not a problem given to the profile but to two other factors. First a misplacement of the components on the pads, second a too low Nitrogen level in case the the reflow process occurs under a nitrogen atmosphere. Could be also given to a sum of both.

5 zone ovens become a problem with the new lead-free past. The higher melting point of the paste, while the maximum temperature allowed by the components, leave a smaller window in whicht you can play. with more zone you can fine tune the profile to reach the smallest possible Delta-T between big and small components during the preheating, This will allow to no overheat the small components while giving enough time to the big components to be properly soldered